Samsung Roadmap Includes 1.4-nm Production by 2027
Samsung Electronics expects to reach 1.4-nm production by 2027.
With the rising demand for advanced semiconductors, the company is stepping up competition with its main rival, Taiwan Semiconductor Manufacturing Co. (TSMC).
Samsung has stated that demand is being fueled by HPC, AI, 5G/6G, and automotive applications.
According to Samsung’s foundry business president Si-young Choi, in a prepared statement, “Samsung’s strategies to secure customers’ trust and support their success” include a technology development goal down to 1.4 nm, foundry platforms specialized for each application, stable supply through consistent investment, and more. “At the heart of our foundry service has always been our ability to help each customer bring their innovative ideas to life in collaboration with our other business partners.”
The business made the initial announcement of 3-nm production this year.
By introducing a 2-nm process in 2025, Samsung intends to advance its gate-all-around (GAA) technology even further.
Investment numbers for capacity growth were not made public by the corporation.
The expansion of semiconductor foundries like TSMC and Samsung has surpassed the industry’s overall expansion.
According to Gartner, the revenue of chip foundries grew by 31% to $100.2 billion in 2017, driving the expansion of the whole semiconductor industry. According to Gartner, Apple, AMD, and MediaTek were TSMC’s three largest customers in the cutting-edge 7-nm and 5-nm nodes.
According to the market research organization, Samsung’s biggest customers Qualcomm, Nvidia, and Tesla relied on the company to produce less sophisticated 8-nm and 14-nm processors.
Intel Foundry Services (IFS), which has been operating for roughly a year, will present Samsung with more competition in addition to TSMC. IFS is working at offering its own GAA-based process at its 18-A node, which is equivalent to 2 nm, by 2024.
In 2025, TSMC plans to begin mass producing 2-nanometer chips.
The Rise of 3D Packaging
In response to demand from foundry clients, Samsung is hastening the maturation of 2.5D/3D heterogeneous integration packaging.
The business has announced that its X-Cube 3D packaging with micro-bump connection will be ready for production in 2024, and that a bump-free version of X-Cube would be available in 2026.
When it comes to high-performance and low-power applications, Samsung is aiming for the HPC, automotive, 5G, and IoT markets. The business plans to diversify its 4-nm process designed for HPC and automotive applications while improving its GAA-based 3-nm process support for high-performance computing and mobile devices.
To meet the needs of the automobile industry, Samsung offers a 28-nanometer (nm) embedded nonvolatile memory (eNVM) method. In 2024, the firm expects to introduce 14-nm eNVM solutions, with 8-nm eNVM to follow at a later, as-yet-undisclosed date.
At present, Samsung is manufacturing 8-nm RF, and 5-nm RF is in the works.
The corporation has declared that it will increase its advanced node production capacity by a factor of three by the year 2027.
The foundries that make Samsung products can be found in both South Korea and Texas.
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